Application Areas Suitable for high-precision multi-chip die bonding of VCSELs, PDs, TIAs, LDDs, etc., typically used in 400G and 800G high-speed optical modules. Equipment Advantages High Precision: ±3μm positional accuracy; ±0.3° angular accuracy. High Flexibility: Multi-nozzle configuration, flexible switching, capable of handling various chip sizes simultaneously. Precise Force Control: Voice coil motor programmable die bonding pressure ensures precise and stable force control. Supports 6-inch wafer rings, waffle boxes, GELPAK, and other chip feeding methods, with automatic substrate loading and unloading. Standard adhesive dispensing system with heated dispensing needles; optional syringe dispensing module. Digital die-slip detection with alarm or automatic chip re-picking function; Postbond pick-up and drop-off accuracy detection and statistics. Inherits the ease of use of Mini LED die bonding machine software, with simple and quick programming/line conversion.
1340×1380×1730 mm (excluding monitor, tri-color LEDs and FFU)
