A linear motor-driven dual dispensing system. High-precision linear drive die bonders with voice coil torque rings precisely control die bonding pressure. A high-precision chip search platform with a servo motor-driven chip angle correction system, equipped with a 12-inch wafer automatic film expansion system for automatic die ring loading and unloading. An independent dispensing control system ensures more precise glue volume control. Vacuum die leak detection is employed. An industrial computer controls the equipment, simplifying operation. Precise automated equipment provides effective assurance for enterprises to improve production efficiency and reduce costs, thereby significantly enhancing their competitiveness.
