How does the high-speed silver paste die bonder drive semiconductor manufacturing upgrades with its precision?
Publish Time: 2025-11-18
In the intricate chain of semiconductor packaging processes, chip bonding is a crucial step determining device performance and reliability. The high-speed silver paste die bonder, as the core equipment in this process, is redefining modern packaging standards of high precision, high efficiency, and high consistency through cutting-edge technologies such as linear motor drive, closed-loop pressure control, intelligent vision recognition, and full-process automation. It is not only a "skilled hand" on the production line but also a strategic fulcrum for enterprises moving towards intelligent manufacturing and high-end competition.
The core power of the high-speed silver paste die bonder stems from a dual-dispensing system driven by a high-response linear motor. Compared to traditional lead screws or belt drives, linear motors have no mechanical contact, no backlash, and high acceleration, achieving microsecond-level dynamic response and nanometer-level positioning accuracy. The simultaneous operation of the two dispensing heads ensures uniform silver paste coating while minimizing cycle time, significantly increasing unit throughput. Equipped with an independent dispensing control system, the system precisely controls the nano-level adhesive volume by adjusting air pressure, time, and needle height in real time, avoiding adhesive overflow, insufficient adhesive, or stringing. This ensures that the silver paste distribution on the bottom of each chip is just right, providing an ideal interface for subsequent bonding.
The chip bonding process is completed collaboratively by a high-precision linear drive platform and a voice coil torque ring. The voice coil motor has extremely high force control resolution, applying a preset pressure at the moment of bonding and adjusting it in real time, controlling pressure fluctuations within ±0.1N. This closed-loop pressure management effectively prevents chip breakage due to overpressure or bonding failure due to underpressure, making it particularly suitable for sensitive materials such as ultra-thin chips, MEMS devices, and compound semiconductors. The bonding process is stable and highly repeatable, significantly improving the yield rate.
To achieve precise alignment with a "what you see is what you get" approach, the equipment is equipped with a high-resolution chip search platform. This platform features a servo motor-driven angle correction system that automatically identifies the rotational deviation of the chip after pickup and performs sub-degree angle compensation, ensuring that the chip is accurately mounted onto the substrate or leadframe with the correct orientation. Simultaneously, it integrates a 12-inch wafer automated thin-film deployment system, supporting fully automated feeding, film expansion, alignment, and chip ring loading/unloading of blue/UV film wafers, requiring no manual intervention throughout the process. This reduces the risk of human contamination and ensures the stability of continuous production.
Quality control is integrated throughout the entire process. The equipment incorporates a vacuum chip leakage detection module, performing a negative pressure test on the bottom of the chip after bonding to quickly identify sealing defects caused by bubbles, voids, or uneven adhesive layers, enabling online yield monitoring and automatic rejection of defective products. This function is particularly important for high-reliability applications such as automotive electronics and medical chips.
The entire machine is centrally scheduled by an industrial computer, with a simple and intuitive user interface. Process parameters can be accessed, stored, and traced with a single click. The equipment supports integration with MES systems, enabling real-time uploading of production data and remote diagnostics, providing underlying support for digital factory management. From wafer to finished product, from dispensing to testing, the entire process is highly integrated, significantly reducing reliance on skilled technicians while shortening changeover time and improving flexible production capabilities.
With Moore's Law approaching its physical limits, advanced packaging has become a crucial path to continue improving semiconductor performance. With its micron-level precision, millisecond-level cycle time, and intelligent control, the high-speed silver paste die bonder not only meets the stringent requirements of emerging fields such as Mini LED, power modules, and RF devices for high-density interconnects, but also helps companies reduce costs and increase efficiency with its stable and reliable performance. Operating silently in cleanrooms, it subtly propels China's semiconductor industry chain to a higher value chain with its precision.
